Steffen Bickel

Publications

Citations

H-Index

2017

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Steffen Bickel is an author at Fraunhofer Institute for Reliability and Microintegration specializing in interfacial phenomena, 3d integration, and microfabrication.

ORCID

Top concepts

Engineering3D IntegrationMicrostructureApplied PhysicsNanoelectronicsMaterial ScienceMicroelectronicsMicrofabricationAdvanced PackagingIntegrated Circuits

Publications per year

2017–2018

Publications

Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration

Iuliana Panchenko, Steffen Bickel, Jörg Meyer et al. · Japanese Journal of Applied Physics · 2017 · 19 citations

Engineering, Fine-pitch Interconnects, Integrated Circuits +20

Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength

Steffen Bickel, R. Hoehne, Iuliana Panchenko et al. · 2018 · 10 citations

Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality

Steffen Bickel, Shawon Sen, Jörg Meyer et al. · 2018 7th Electronic System-Integration Technology Conference (ESTC) · 2018 · 10 citations

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