Laura Wenzel

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Active since

2022

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Laura Wenzel is an author at Fraunhofer Institute for Reliability and Microintegration specializing in semiconductor interfaces, interconnect technology, and materials science.

ORCID

Publications per year

2022–2024

Publications

Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests

Iuliana Panchenko, Laura Wenzel, Maik Mueller et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 21 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects

Laura Wenzel, Catharina Rudolph, Adil Shehzad et al. · 2024 · 12 citations

Engineering, Materials Engineering, Materials Science +14

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