Catharina Rudolph

Statistics

Publications

Citations

170

H-Index

Active since

2013

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Dresden

Fraunhofer-Gesellschaft

Catharina Rudolph is an author at Fraunhofer Institute for Reliability and Microintegration specializing in materials science, materials engineering, and semiconductor devices.

Publications per year

2013–2024

Publications

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 63 citations

Engineering, Materials Engineering, Materials Science +16

μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization

P. Saettler, M. Hecker, M. Boettcher et al. · Microelectronic Engineering · 2015 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +12

Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

Catharina Rudolph, Anke Hanisch, M. Voigtlander et al. · 2021 · 23 citations

Engineering, Manufacturing Engineering, Materials Science +17

Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests

Iuliana Panchenko, Laura Wenzel, Maik Mueller et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 21 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Grain Structure Analysis of Cu/SiO<sub>2</sub> Hybrid Bond Interconnects after Reliability Testing

Iuliana Panchenko, Laura Wambera, Maik Mueller et al. · 2020 · 14 citations

Engineering, Materials Engineering, Materials Science +16

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