Catharina Rudolph

Statistics

Publications

Citations

165

H-Index

Active since

2013

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Dresden

Fraunhofer-Gesellschaft

Catharina Rudolph is an author at Fraunhofer Institute for Reliability and Microintegration specializing in materials science, engineering, and applied physics.

Top concepts

Material ScienceEngineeringApplied PhysicsMicroelectronicsIntegrated CircuitsElectronic PackagingMicrostructureMicrofabricationAdvanced PackagingElectrical Engineering

Publications per year

2013–2024

Publications

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 62 citations

Engineering, High Throughput, Integrated Circuits +16

μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization

P. Saettler, M. Hecker, M. Boettcher et al. · Microelectronic Engineering · 2015 · 26 citations

Materials Science, Surface Characterization, Spectroscopy +3

Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

Catharina Rudolph, Anke Hanisch, M. Voigtlander et al. · 2021 · 22 citations

Engineering, Simulated Process Parameters, Industrial Engineering +20

Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests

Iuliana Panchenko, Laura Wenzel, Maik Mueller et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 20 citations · Full text

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Grain Structure Analysis of Cu/SiO<sub>2</sub> Hybrid Bond Interconnects after Reliability Testing

Iuliana Panchenko, Laura Wambera, Maik Mueller et al. · 2020 · 14 citations

Materials Science, Advanced Packaging, Wafer Stack +15

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