Maik Mueller

The effect of downscaling the dimensions of solder interconnects on their creep properties

Steffen Wiese, M. Roellig, Maik Mueller et al. · Microelectronics Reliability · 2008 · 47 citations

Materials Science, Materials Engineering, Solder Interconnects +13

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen, Maik Mueller, Tonu Tuomas Mattila et al. · Journal of materials research/Pratt's guide to venture capital sources · 2011 · 47 citations

Materials Science, Engineering, Corrosion +12

Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints

Maik Mueller, Steffen Wiese, M. Roellig et al. · 2007 · 38 citations

Friction Welding, Engineering, Solder Ball +17

Failure mechanism of solder interconnections under thermal cycling conditions

Toni T. Mattila, Maik Mueller, Mervi Paulasto‐Kröckel et al. · 2010 · 22 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +23

The Influence of Size and Composition on the Creep of SnAgCu Solder Joints

Steffen Wiese, M. Roellig, Maik Mueller et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 20 citations

Materials Science, Creep Experiments, High Temperature Materials +14