Publication | Closed Access
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
47
Citations
30
References
2011
Year
Materials ScienceEngineeringCorrosionMechanical EngineeringLead-free Solder InterconnectionsThermal CyclingMetallurgical InteractionCold WorkingHot WorkingHeat TreatingElectronic PackagingHeat TransferThermal EngineeringThermomechanical ProcessingMicrostructure
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