Klaus-Juergen Wolter

Author

Technische Universität Dresden

Also Known As

Klaus-Juergen Wolter

Publications

512

Citations

H-Index

Concepts

All Affiliations

Technische Universität Dresden Fraunhofer Institute for Reliability and Microintegration IMEC KU Leuven

About

Klaus-Juergen Wolter is an author at Technische Universität Dresden specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	329
2	Materials Science	11	11	300
3	Applied Physics	6	6	173
4	Materials Engineering	5	5	158
5	Electrical Engineering	4	4	100

Klaus-Juergen Wolter

Publications

329

Citations

H-Index

Page 1

	Year	Citations
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects Iuliana Panchenko, Kristof Croes, Ingrid De Wolf, Microelectronic Engineering Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)	2013	73
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling Hongtao Chen, Maik Mueller, Tonu Tuomas Mattila, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceEngineeringCorrosionMechanical EngineeringLead-free Solder Interconnections	2011	47
Investigations of carbon nanotubes epoxy composites for electronics packaging Matthias Heimann, Martin Wirts-Ruetters, Bjoern Boehme, EngineeringEpoxy MatrixElectronic DevicesCarbon-based MaterialAdvanced Packaging (Semiconductors)	2008	41
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept M. Roellig, R. Dudek, Steffen Wiese, Microelectronics Reliability Materials ScienceElectrical EngineeringEngineeringLead-free Solder ContactsCorrosion	2006	33
Integration of polymer optical waveguides by using flexographic and aerosol jet printing Thomas Reitberger, Jörg Franke, Gerd-Albert Hoffmann, WaveguidesOptical MaterialsEngineeringMechanical EngineeringFiber Optics	2016	19
The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders Maik Mueller, Steffen Wiese, M. Roellig, EngineeringMechanical EngineeringRefrigerationSnagcu SoldersCooling Rate	2007	17
Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading Karsten Meier, M. Roellig, Klaus-Juergen Wolter Reliability StudyEngineeringTemperature Shock TestsMechanical EngineeringDamage Mechanism	2014	17
Effects of bonding pressure on quality of SLID interconnects Iuliana Panchenko, Juergen Grafe, Maik Mueller, 2012 4th Electronic System-Integration Technology Conference EngineeringSlid InterconnectsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Electron Microscopy	2012	15
Life time prediction for lead-free solder joints under vibration loads Karsten Meier, M. Roellig, Klaus-Juergen Wolter EngineeringLife PredictionMechanical EngineeringDeterioration ModelingDamage Mechanism	2011	15
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking Iuliana Panchenko, Klaus-Juergen Wolter, Kristof Croes, Microelectronics Reliability Materials EngineeringMaterials Science3D Ic ArchitectureIsothermal StorageEngineering	2019	15

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