Klaus-Juergen Wolter

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Iuliana Panchenko, Kristof Croes, Ingrid De Wolf et al. · Microelectronic Engineering · 2013 · 73 citations

Materials Engineering, Materials Science, Electromigration Technique +7

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen, Maik Mueller, Tonu Tuomas Mattila et al. · Journal of materials research/Pratt's guide to venture capital sources · 2011 · 47 citations

Materials Science, Engineering, Corrosion +12

Investigations of carbon nanotubes epoxy composites for electronics packaging

Matthias Heimann, Martin Wirts-Ruetters, Bjoern Boehme et al. · 2008 · 41 citations

Engineering, Epoxy Matrix, Electronic Devices +17

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept

M. Roellig, R. Dudek, Steffen Wiese et al. · Microelectronics Reliability · 2006 · 33 citations

Materials Science, Electrical Engineering, Engineering +9

Integration of polymer optical waveguides by using flexographic and aerosol jet printing

Thomas Reitberger, Jörg Franke, Gerd-Albert Hoffmann et al. · 2016 · 19 citations

Waveguides, Optical Materials, Engineering +22