Concepedia

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept

M. Roellig, R. Dudek, Steffen Wiese, Bjoern Boehme, Klaus-Juergen Wolter, Bernd Michel

Microelectronics Reliability · 2006 · 33 citations · 3 references

DOI

Concepts

References

3

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Andreas Schubert, R. Dudek, E. Auerswald et al. · 2003 · 386 citations

, , +17

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

, , +14

Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints

J.H.L. Pang · 2005 · 67 citations

, , +17