Bernd Michel

Statistics

Publications

Citations

636

H-Index

Active since

1997

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Fraunhofer Institute for Electronic Nano Systems

Chemnitz University of Technology

Technische Universität Dresden

Angewandte Micro Messtechnik (Germany)

Bernd Michel is an author at Fraunhofer Institute for Reliability and Microintegration specializing in materials science, materials engineering, and engineering.

Publications per year

1997–2015

Publications

High aspect ratio TSV copper filling with different seed layers

M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle et al. · 2008 · 109 citations

Engineering, Materials Engineering, Materials Science +13

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

N. Sabaté, Dietmar Vogel, Astrid Gollhardt et al. · Journal of Microelectromechanical Systems · 2007 · 62 citations · Full text

Engineering, Materials Science, Mechanical Engineering +17

Energy Dispersive X‐Ray Diffraction

Bernd Kämpfe, Falk Luczak, Bernd Michel · Particle & Particle Systems Characterization · 2005 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +13

Special Issue on 2nd International Conference on Smart Systems Engineering (SmaSys 2014)

Ajit Khosla, Hidemitsu Furukawa, Bernd Michel · Microsystem Technologies · 2015 · 38 citations · Full text

Engineering, Electrical Engineering, Systems Engineering +17

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Parisa Bayat, Dietmar Vogel, Raúl D. Rodriguez et al. · Microelectronic Engineering · 2015 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +17

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