Concepedia

Steffen Wiese

SW

Statistics

Publications

57

Citations

1.7K

H-Index

22

Active since

1995

Affiliations

Technische Universität Dresden(Current)

Saarland University

Institut für Energie- und Umwelttechnik

Fraunhofer Center for Silicon Photovoltaics

Robert Bosch (Germany)

Steffen Wiese is an author at Technische Universität Dresden specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringElectronic PackagingMechanics Of MaterialsMicrostructureSolid MechanicsMaterials EngineeringElectrical EngineeringApplied Physics

Publications per year

1995–2022

57

Publications

57

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

Steffen Wiese, K.-J. Wolter · Microelectronics Reliability · 2004 · 103 citations

Materials Science, Materials Engineering, Snagcu Solders +4

Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders

Steffen Wiese, E. Meusel, Klaus‐Jürgen Wolter · 2004 · 101 citations

Materials Science, Eutectic Snag, Engineering +11

Time-independent elastic–plastic behaviour of solder materials

Steffen Wiese, Sven Rzepka · Microelectronics Reliability · 2004 · 83 citations

Materials Science, Engineering, Severe Plastic Deformation +8

Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints

Steffen Wiese, F. Feustel, E. Meusel · Sensors and Actuators A Physical · 2002 · 81 citations

Materials Science, Engineering, Chip On Board +6

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