K.-J. Wolter - Concepedia

Author

K.-J. Wolter

Also Known As

Berghold, J., K. - J. Wolter, K. -J. Wolter, K. J. Wolter, K. Wolter, K.-J Wolter, K.-J. Wolter, K.J. Wolter, Klaus J. Wolter, Klaus Jurgen Wolter

Publications

641

Citations

H-Index

Concepts

All Affiliations

Technische Universität Dresden Fraunhofer Institute for Ceramic Technologies and Systems Fraunhofer-Gesellschaft Robert Bosch (Germany)Wrocław University of Science and Technology

About

K.-J. Wolter is an author at Technische Universität Dresden specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	16	401
2	Applied Physics	5	5	169
3	Health Sciences	1	1	11
4	Medicine	1	1	15
5	Biomedical Engineering	1	1	18

K.-J. Wolter

Publications

417

Citations

H-Index

Page 1

	Year	Citations
Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders Steffen Wiese, K.-J. Wolter Microelectronics Reliability Materials ScienceMaterials EngineeringSnagcu SoldersEngineeringApplied Physics	2004	103
Creep of thermally aged SnAgCu-solder joints Steffen Wiese, K.-J. Wolter Microelectronics Reliability Materials ScienceEngineeringSnagcu-solder JointsMechanical EngineeringHot Working	2006	79
Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading Rico Meier, Frank Alexander Kraemer, Steffen Wiese, EngineeringMechanical EngineeringSolar Cell InterconnectorsPhotovoltaic SystemPhotovoltaics	2010	23
Embedded passive components for MCM K.-J. Wolter, Andrzej Dziedzic, Jarosław Kita, Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Device IntegrationMicrofabrication	2002	21
Characterization of the annealing behavior for copper-filled TSVs P. Saettler, M. Boettcher, K.-J. Wolter EngineeringSevere Plastic DeformationSilicon ViasInterconnect (Integrated Circuits)Electronic Packaging	2012	20
Creep of thermally aged SnAgCu-solder joints Steffen Wiese, M. Roellig, K.-J. Wolter Materials ScienceSnagcu-solder DiffersEngineeringSnagcu-solder JointsMechanical Engineering	2005	18
Influence of artificial body fluids and medical sterilization procedures on chemical stability of Parylene C Natalia Beshchasna, B. Adolphi, Sergey Granovsky, Materials ScienceHigh Thermal StabilityChemical EngineeringEngineeringPolymer Technology	2010	18
Fodel microresistors––processing and basic electrical properties Andrzej Dziedzic, Lars Rebenklau, K.-J. Wolter Microelectronics Reliability Electrical EngineeringEngineeringMicrofabricationNanoelectronicsApplied Physics	2003	16
Plasma treatment for fluxless soldering R. Deltschew, D. Hirsch, H. Neumann, Surface and Coatings Technology Plasma ApplicationPlasma ProcessingPlasma TreatmentNonthermal Plasma	2001	16
Dual resonance excitation system for the contact mode of atomic force microscopy Malgorzata Kopycinska‐Müller, André Striegler, Ronny Schlegel, Review of Scientific Instruments Atomic Force MicroscopyContact ModeEngineeringAfm TipMicroscopy	2012	15

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