Embedded passive components for MCM

Abstract

MCMs often have a large number of passive components connected to a small number of active devices. Integration of passive components into the MCM substrate improves electrical properties and reliability, and also reduces the cost, size and weight of electronic systems. The embedded components are mostly used in MCM-D (thin film) and MCM-C (thick film) modules. The use of embedded elements for MCM-L is at the early stage of development. The basic information on embedded passives as well as the activity of Dresden University of Technology and Wroclaw University of Technology in the area of LTCC buried passives is presented.