Publication | Closed Access
Creep of thermally aged SnAgCu-solder joints
79
Citations
23
References
2006
Year
Materials ScienceEngineeringSnagcu-solder JointsMechanical EngineeringHot WorkingSolid MechanicsElectronic PackagingThermomechanical AnalysisThermal EngineeringThermomechanical ProcessingMechanics Of MaterialsMicrostructure
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