F. Feustel

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints

Steffen Wiese, F. Feustel, E. Meusel · Sensors and Actuators A Physical · 2002 · 81 citations

Materials Science, Engineering, Chip On Board +6

Time-dependent material modeling for finite element analyses of flip chips

F. Feustel, Steffen Wiese, E. Meusel · 2002 · 34 citations

Engineering, Time-dependent Material Modeling, Mechanical Engineering +19

Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints

Steffen Wiese, F. Feustel, Sven Rzepka et al. · MRS Proceedings · 1998 · 22 citations

Materials Science, Materials Engineering, Friction Welding +9

Taking SOI substrates and low-k dielectrics into high-volume microprocessor production

D. Greenlaw, G. Burbach, Thomas Feudel et al. · 2004 · 19 citations

Engineering, Vlsi Design, Industrial Engineering +16