Sven Rzepka

Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation

Sven Rzepka, Kaustav Banerjee, E. Meusel et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 116 citations

Engineering, Vlsi Design, Computer Architecture +19

Time-independent elastic–plastic behaviour of solder materials

Steffen Wiese, Sven Rzepka · Microelectronics Reliability · 2004 · 83 citations

Materials Science, Engineering, Severe Plastic Deformation +8

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Sven Rzepka, M. A. Korhonen, E. Meusel et al. · Journal of Electronic Packaging · 1998 · 48 citations

Engineering, Flip-chip Solder Joints, Underfill Delamination +19

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Parisa Bayat, Dietmar Vogel, Raúl D. Rodriguez et al. · Microelectronic Engineering · 2015 · 34 citations

Materials Science, Atomic Force Microscopy, Thermo-mechanical Characterization +10

The effects of underfill on the reliability of flip chip solder joints

Peng Su, Sven Rzepka, M. A. Korhonen et al. · Journal of Electronic Materials · 1999 · 33 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +6