E. Meusel

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation

Sven Rzepka, Kaustav Banerjee, E. Meusel et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 116 citations

Engineering, Vlsi Design, Computer Architecture +19

Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders

Steffen Wiese, E. Meusel, Klaus‐Jürgen Wolter · 2004 · 101 citations

Materials Science, Eutectic Snag, Engineering +11

Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints

Steffen Wiese, F. Feustel, E. Meusel · Sensors and Actuators A Physical · 2002 · 81 citations

Materials Science, Engineering, Chip On Board +6

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Sven Rzepka, M. A. Korhonen, E. Meusel et al. · Journal of Electronic Packaging · 1998 · 48 citations

Engineering, Flip-chip Solder Joints, Underfill Delamination +19