Concepedia

Bjoern Boehme

BB

3

Publications

87

Citations

3

H-Index

2006

Active since

Affiliations

Technische Universität Dresden(Current)

Bjoern Boehme is an author at Technische Universität Dresden specializing in materials science, electronic packaging, and engineering.

Top concepts

Publications per year

2006–2014

3

Publications

3

Investigations of carbon nanotubes epoxy composites for electronics packaging

Matthias Heimann, Martin Wirts-Ruetters, Bjoern Boehme et al. · 2008 · 41 citations

, , +17

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept

M. Roellig, R. Dudek, Steffen Wiese et al. · Microelectronics Reliability · 2006 · 33 citations

, , +9

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

K. Y. Au, Jie Li Aw, Jong‐Kai Lin et al. · 2014 · 13 citations

, , +20

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