Jie Li Aw

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

K. Y. Au, Jie Li Aw, Jong‐Kai Lin et al. · 2014 · 13 citations

Engineering, Cpi Challenges, Mechanical Engineering +20

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Fu Long Lau, Riko I Made, Wahyuaji Narottama Putra et al. · Microelectronics Reliability · 2013 · 12 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

K. Y. Au, Jong‐Kai Lin, Hsiao Hsiang-Yao et al. · 2016 · 12 citations

Engineering, Cu Pillar, Mechanical Engineering +18

Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

Vempati Srinivasa Rao, Ser Choong Chong, Chen Zhao-hui et al. · 2013 · 11 citations

Engineering, Mechanical Engineering, Wafer Level Underfill +20