Jie Li Aw - Concepedia

Author

Jie Li Aw

Also Known As

J.L. Aw, Jie Li Aw

Publications

Citations

H-Index

Concepts

All Affiliations

Jie Li Aw is an author at Institute of Microelectronics specializing in materials science, microelectronics, and electronic packaging.

#	Concept	H-Index	Publications	Citations
1	Engineering	4	4	48
2	Materials Science	4	4	48
3	Applied Physics	3	3	36
4	Materials Engineering	2	2	25
5	Electrical Engineering	1	1	12

Jie Li Aw

Publications

Citations

H-Index

Page 1

	Year	Citations
Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip K. Y. Au, Jie Li Aw, Jong‐Kai Lin, EngineeringCpi ChallengesMechanical EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)	2014	13
Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics Fu Long Lau, Riko I Made, Wahyuaji Narottama Putra, Microelectronics Reliability Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringHigh Voltage Engineering	2013	12
Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad K. Y. Au, Jong‐Kai Lin, Hsiao Hsiang-Yao, EngineeringCu PillarMechanical EngineeringThermal Compression BondingInterconnect (Integrated Circuits)	2016	12
Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications Vempati Srinivasa Rao, Ser Choong Chong, Chen Zhao-hui, EngineeringMechanical EngineeringWafer Level UnderfillIntegrated CircuitsFlip Chip Bonding	2013	11

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