Jong‐Kai Lin

Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing

Jin‐Wook Jang, Lakshmi N. Ramanathan, Jong‐Kai Lin et al. · Journal of Applied Physics · 2004 · 62 citations

Materials Science, Materials Engineering, Engineering +14

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · 2002 · 55 citations

Engineering, Pb-free Solders, Mechanical Engineering +17

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

Engineering, Pb-free Solders, Mechanical Engineering +17

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

Fa Xing, Xiaowu Zhang, Jong‐Kai Lin · Microelectronics Reliability · 2016 · 37 citations

3D Ic Architecture, Electrical Engineering, Reliability Study +13

Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Jin‐Wook Jang, Ananda P. De Silva, J. Drye et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 31 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19