Fa Xing

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

Luhua Xu, J.H.L. Pang, Fa Xing · Journal of Electronic Materials · 2008 · 99 citations

Materials Science, Materials Engineering, Electrical Engineering +11

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Dhafer Abdulameer Shnawah, Suhana Mohd Said, Mohd Faizul Mohd Sabri et al. · Journal of Electronic Materials · 2012 · 98 citations

Materials Science, Electrical Engineering, Engineering +5

Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers

Fa Xing, H.Y. Li, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 70 citations

Engineering, Mechanical Engineering, Wafer Stress +21

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

Dhafer Abdulameer Shnawah, Suhana Mohd Said, Mohd Faizul Mohd Sabri et al. · Materials Science and Engineering A · 2012 · 67 citations

Materials Engineering, Materials Science, Magnetic Properties +8

Microstructural stability of Sn–1Ag–0.5Cu–xAl (x=1, 1.5, and 2wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties

Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Irfan Anjum Badruddin et al. · Materials Characterization · 2013 · 64 citations

Materials Engineering, Materials Science, High Temperature Materials +9