Fa Xing

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Dhafer Abdulameer Shnawah, Suhana Mohd Said, Mohd Faizul Mohd Sabri et al. · Journal of Electronic Materials · 2012 · 100 citations

Engineering, Materials Engineering, Materials Science +12

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

Luhua Xu, J.H.L. Pang, Fa Xing · Journal of Electronic Materials · 2008 · 99 citations

Engineering, Materials Engineering, Materials Science +16

Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers

Fa Xing, H.Y. Li, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 75 citations

Engineering, Manufacturing Engineering, Materials Science +15

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

Dhafer Abdulameer Shnawah, Suhana Mohd Said, Mohd Faizul Mohd Sabri et al. · Materials Science and Engineering A · 2012 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +17

Interaction of multiple inhomogeneous inclusions beneath a surface

Kun Zhou, L. M. Keer, Q. Jane Wang et al. · Computer Methods in Applied Mechanics and Engineering · 2012 · 65 citations

Natural Sciences, Earth Sciences, Materials Science +7