H.Y. Li - Concepedia

Author

H.Y. Li

Institute of Microelectronics ORCID

Also Known As

H. Y. Li, H.Y. Li, Haifang Li, Haiwen Li, Haoyun Li, Hengkuan Li, Hongyu Y. Li, Li, Haifang

Publications

427

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics Agency for Science, Technology and Research Nanyang Technological University Singapore Science Park

About

H.Y. Li is an author at Institute of Microelectronics specializing in electronic packaging, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	345
2	Applied Physics	5	5	197
3	Computer Engineering	4	4	158
4	Natural Sciences	1	1	12
5	Chemistry	1	1	13

H.Y. Li

Publications

345

Citations

H-Index

Page 1

	Year	Citations
Development of through silicon via (TSV) interposer technology for large die (21&#x00D7;21mm) fine-pitch Cu/low-k FCBGA package Xiaowu Zhang, T.C. Chai, John H. Lau, EngineeringComputer ArchitectureLarge DieInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2009	109
Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers Fa Xing, H.Y. Li, Xiaowu Zhang, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringMechanical EngineeringWafer StressComputer-aided DesignStructural Optimization	2012	70
Modelling and characterization on wafer to wafer hybrid bonding technology for 3D IC packaging Lin Ji, Hongmiao Ji, H.Y. Li, EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2019	42
A small OCA on a 1/spl times/0.5-mm/sup 2/ 2.45-GHz RFID Tag-design and integration based on a CMOS-compatible manufacturing technology A.P. Popov, H.Y. Li, Yu-Hsing Wang, IEEE Electron Device Letters Cmos-compatible Manufacturing TechnologyEngineeringRadio FrequencyDc PowerRadio Frequency Identification	2006	24
Bendability of single-crystal Si MOSFETs investigated on flexible substrate H.Y. Li, W.Y. Loh, L. K. Bera, IEEE Electron Device Letters EngineeringMechanical EngineeringSilicon On InsulatorSemiconductor DeviceAdvanced Packaging (Semiconductors)	2006	23
Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System Q.X. Zhang, Aibing Yu, Rui Yang, Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Device IntegrationMicrofabrication	2006	15
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections C.F. Tsang, Chia-Pin Chang, Ahila Krishnamoorthy, Microelectronics Reliability Electrical EngineeringElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)Electronic Packaging	2004	14
Impact of packaging design on reliability of large die Cu/low-&#x03BA; (BD) interconnect T.C. Chai, Xiaowu Zhang, H.Y. Li, Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Pad Structure	2008	13
Successful transferring of active transistors, rf-passive components and high density interconnect from bulk si to organic substrates Q.X. Zhang, H.Y. Li, E.B. Liao, EngineeringDevice IntegrationOrganic ElectronicsChemistryInterconnect (Integrated Circuits)	2006	13
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay K. Ghosh, Jun Zhang, L. Zhang, EngineeringAlternative Filler MaterialsMechanical EngineeringComputational MechanicsInterconnect (Integrated Circuits)	2012	12

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