High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

Engineering, Materials Engineering, Materials Science +9

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Natural Sciences, Materials Engineering, Materials Science +12

Mechanisms of fatigue crack propagation in metals, ceramics and composites: Role of crack tip shielding

Robert O. Ritchie · Materials Science and Engineering A · 1988 · 860 citations

Engineering, Materials Engineering, Materials Science +14

Properties of lead-free solder alloys with rare earth element additions

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Materials Science and Engineering R Reports · 2004 · 587 citations

Natural Sciences, Materials Engineering, Materials Science +10

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 557 citations

Natural Sciences, Materials Engineering, Materials Science +14