Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications - Concepedia

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Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

67

Citations

29

References

2012

Year

Dhafer Abdulameer Shnawah, Suhana Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing

Materials Science and Engineering A

Materials EngineeringMaterials ScienceMagnetic PropertiesEngineeringMechanical EngineeringAlloy DesignHot WorkingAlloy CastingElectronics ApplicationsMicrostructureThermal Properties

References

	Year	Citations

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