J. Drye

Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits

L. Mahalingam, J. Andrews, J. Drye · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 40 citations

Engineering, Computer Engineering, Electrical Engineering +15

Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Jin‐Wook Jang, Ananda P. De Silva, J. Drye et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 31 citations

Engineering, Materials Engineering, Materials Science +17

Motorola MEMS switch technology for high frequency applications

A.P. De Silva, C. Vaughan, D. R. Frear et al. · 2002 · 22 citations

Engineering, Electrical Engineering, Low-power Design +16

Conductive polymer bump interconnects

Jong‐Kai Lin, J. Drye, William Lytle et al. · 2002 · 21 citations

Engineering, Electrical Engineering, Materials Science +17

System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

Robert E. Jones, C. Ramiah, Telesphor Kamgaing et al. · IEEE Transactions on Advanced Packaging · 2005 · 16 citations

Engineering, Electrical Engineering, Microwave Engineering +16