Concepedia

William Lytle

WL

Statistics

Publications

4

Citations

187

H-Index

4

Active since

1996

Affiliations

Motorola (United States)(Current)

William Lytle is an author at Motorola (United States) specializing in semiconductor devices, electrical engineering, and electronic materials.

Publications per year

1996–2008

4

Publications

4

The Redistributed Chip Package: A Breakthrough for Advanced Packaging

Beth Keser, Craig Amrine, Trung Q. Duong et al. · 2007 · 112 citations

Engineering, Computer Engineering, Electrical Engineering +17

Advanced Packaging: The Redistributed Chip Package

Beth Keser, Craig Amrine, Trung Q. Duong et al. · IEEE Transactions on Advanced Packaging · 2008 · 40 citations

Engineering, Electrical Engineering, Electronic Materials +15

Conductive polymer bump interconnects

Jong‐Kai Lin, J. Drye, William Lytle et al. · 2002 · 21 citations

Engineering, Electrical Engineering, Materials Science +17

Application of a CFD tool in designing a fountain plating cell for uniform bump plating of semiconductor wafers

Tien‐Yu Tom Lee, William Lytle, B. Hileman · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 14 citations

Engineering, Electrical Engineering, Materials Engineering +14

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