Beth Keser

The Redistributed Chip Package: A Breakthrough for Advanced Packaging

Beth Keser, Craig Amrine, Trung Q. Duong et al. · 2007 · 112 citations

Advanced Packaging, Industrial Design, Electrical Engineering +14

Advanced Packaging: The Redistributed Chip Package

Beth Keser, Craig Amrine, Trung Q. Duong et al. · IEEE Transactions on Advanced Packaging · 2008 · 40 citations

Engineering, Chip Bga Packaging, Computer Architecture +17

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

Michael J. Topper, J. Auersperg, V. Glaw et al. · 2000 · 40 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Encapsulated double-bump WL-CSP: design and reliability

Beth Keser, Betty Yeung, J. White et al. · 2002 · 22 citations

Engineering, Mechanical Engineering, Encapsulation Material +19

Electromigration studies of lead-free solder balls used for wafer-level packaging

Christine Hau-Riege, Ricky Zang, You-Wen Yau et al. · 2011 · 19 citations

Materials Science, Bump Metallurgy, Electrical Engineering +14