You-Wen Yau

Requirement of effective fabless/foundry interactions for achieving robust product reliability

S. Kalpat, Homyar Mogul, Christine Hau-Riege et al. · 2010 · 20 citations

Engineering, Industrial Engineering, Fabless Companies +24

Electromigration studies of lead-free solder balls used for wafer-level packaging

Christine Hau-Riege, Ricky Zang, You-Wen Yau et al. · 2011 · 19 citations

Materials Science, Bump Metallurgy, Electrical Engineering +14

An Innovative Understanding of Metal–Insulator–Metal (MIM)-Capacitor Degradation Under Constant-Current Stress

Chi-Chao Hung, A. S. Oates, Horng‐Chih Lin et al. · IEEE Transactions on Device and Materials Reliability · 2007 · 18 citations

Dielectrics, Engineering, Innovative Understanding +17

A study of wafer level package board level reliability

Steven X. Xu, Beth Keser, Christine Hau-Riege et al. · 2013 · 14 citations

Engineering, Mechanical Engineering, Board Reliability +18

Electromigration of solder balls for wafer-level packaging with different under bump metallurgy and redistribution layer thickness

Christine Hau-Riege, Beth Keser, You-Wen Yau et al. · 2013 · 11 citations

Engineering, Shortest Em Lifetime, Interconnect (Integrated Circuits) +22