Christine Hau-Riege

An introduction to Cu electromigration

Christine Hau-Riege · Microelectronics Reliability · 2004 · 217 citations

Electrometallurgy, Electrical Engineering, Electromigration Technique +6

Electromigration in Cu interconnects with very different grain structures

Christine Hau-Riege, Carl V. Thompson · Applied Physics Letters · 2001 · 138 citations

Materials Science, Materials Engineering, Electrical Engineering +14

The effect of interlevel dielectric on the critical tensile stress to void nucleation for the reliability of Cu interconnects

Christine Hau-Riege, Stefan P. Hau‐Riege, Amit P. Marathe · Journal of Applied Physics · 2004 · 61 citations

Critical Tensile Stress, Engineering, Cu Cap +21

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Arief Suriadi Budiman, Christine Hau-Riege, Won-Chong Baek et al. · Journal of Electronic Materials · 2010 · 46 citations · Full text

Electromigration-induced extrusion failures in Cu/low-k interconnects

Frank Wei, Chee Lip Gan, Tam Lyn Tan et al. · Journal of Applied Physics · 2008 · 42 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19