Arief Suriadi Budiman

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Arief Suriadi Budiman, Hyun-Pyo Shin, Bum‐Joon Kim et al. · Microelectronics Reliability · 2011 · 143 citations

Engineering, Electrical Engineering, Materials Science +14

Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction

Arief Suriadi Budiman, William D. Nix, Nobumichi Tamura et al. · Applied Physics Letters · 2006 · 101 citations

Natural Sciences, Materials Engineering, Materials Science +17

A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction

Arief Suriadi Budiman, Seung Min Han, Julia R. Greer et al. · Acta Materialia · 2007 · 95 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Additive manufacturing of titanium alloys – Enabling re-manufacturing of aerospace and biomedical components

Tim Pasang, Arief Suriadi Budiman, Jiachang Wang et al. · Microelectronic Engineering · 2022 · 80 citations

Engineering, Manufacturing Engineering, Materials Engineering +14

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Hae-A-Seul Shin, Byoung‐Joon Kim, Ju-Heon Kim et al. · Journal of Electronic Materials · 2012 · 72 citations

Engineering, Materials Engineering, Materials Science +17