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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

3D Ic ArchitectureEngineeringMechanical EngineeringApplied PhysicsInterconnect (Integrated Circuits)Semiconductor Device FabricationIntegrated CircuitsElectronic PackagingSilicon On InsulatorMicroelectronicsSynchrotron X-ray Microdiffraction3-Dimensional Integrated CircuitsMicrostructureSilicon Debugging