Sung-Hwan Hwang

Layer-Controlled, Wafer-Scale, and Conformal Synthesis of Tungsten Disulfide Nanosheets Using Atomic Layer Deposition

Jeong-Gyu Song, Jusang Park, Wonseon Lee et al. · ACS Nano · 2013 · 374 citations

Natural Sciences, Materials Engineering, Materials Science +17

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Arief Suriadi Budiman, Hyun-Pyo Shin, Bum‐Joon Kim et al. · Microelectronics Reliability · 2011 · 143 citations

Engineering, Electrical Engineering, Materials Science +14

Diminution of Current-Measurement Error for Vector-Controlled AC Motor Drives

H.-S. Jung, Sung-Hwan Hwang, J.-M. Kim et al. · IEEE Transactions on Industry Applications · 2006 · 126 citations

Engineering, Electrical Engineering, Instrumentation +13

Layer-modulated synthesis of uniform tungsten disulfide nanosheet using gas-phase precursors

Jusang Park, Wonseon Lee, Taejin Choi et al. · Nanoscale · 2014 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Hae-A-Seul Shin, Byoung‐Joon Kim, Ju-Heon Kim et al. · Journal of Electronic Materials · 2012 · 72 citations

Engineering, Materials Engineering, Materials Science +17