Qwan-Ho Chung

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Arief Suriadi Budiman, Hyun-Pyo Shin, Bum‐Joon Kim et al. · Microelectronics Reliability · 2011 · 143 citations

Engineering, Electrical Engineering, Materials Science +14

Joule Heating Effect on the Electromigration Lifetimes and Failure Mechanisms of Sn-3.5Ag Solder Bump

Jang-Hee Lee, Yong-Duk Lee, Young-Bae Park et al. · 2007 · 18 citations

Engineering, Electrical Engineering, Materials Science +17

The study on failure mechanisms of bond pad metal peeling: Part A––Experimental investigation

Insu Jeon, Qwan-Ho Chung · Microelectronics Reliability · 2003 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +12

Electromigration Characteristics of Flip Chip Sn-3.5Ag Solder Bumpsunder Highly Accelerated Conditions

Jang-Hee Lee, Gi-Tae Lim, Young-Bae Park et al. · Journal of the Korean Physical Society · 2009 · 10 citations

Engineering, Electrical Engineering, Materials Science +9