Frank Wei

Electromigration-induced extrusion failures in Cu/low-k interconnects

Frank Wei, Chee Lip Gan, Tam Lyn Tan et al. · Journal of Applied Physics · 2008 · 42 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration

Tailong Shi, Chintan Buch, Vanessa Smet et al. · 2017 · 20 citations

Engineering, Panel Glass Fan-out, Glass Panels +18

Empirical investigations on die edge defects reductions in die singulation processes for glass-panel based interposers for advanced packaging

Frank Wei, Venkatesh Sundaram, Scott McCann et al. · 2015 · 16 citations

Engineering, Optical Glass, Mechanical Engineering +21

Effects of active atomic sinks and reservoirs on the reliability of Cu∕low-k interconnects

Frank Wei, Christine Hau-Riege, Amit P. Marathe et al. · Journal of Applied Physics · 2008 · 16 citations

Engineering, Void Growth, Interconnect (Integrated Circuits) +17

Organic Damascene Process for 1.5-<inline-formula> <tex-math notation="LaTeX">$\mu$ </tex-math> </inline-formula>m Panel-Scale Redistribution Layer Technology Using 5-<inline-formula> <tex-math notation="LaTeX">$\mu$ </tex-math> </inline-formula>m-Thick Dry Film Photosensitive Dielectrics

Fuhan Liu, Chandrasekharan Nair, Atsushi Kubo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 15 citations

Rdl Layer, Engineering, Organic Electronics +22