Statistics
Publications
2
Citations
32
H-Index
2
Active since
2011
Affiliations
Ricky Zang is an author at Qualcomm (United States) specializing in electrical engineering, microelectronics, and electronic packaging.
Publications per year
2011–2011
2
2
Reliability evaluation on low k wafer level packages
Praveen Yadav, Shantanu Kalchuri, Beth Keser et al. · 2011 · 13 citations
Engineering, Reliability Engineering, Advanced Packaging (Semiconductors) +16
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