Concepedia

J. White

JW

Statistics

Publications

6

Citations

172

H-Index

6

Active since

2002

Affiliations

Motorola (United States)(Current)

J. White is an author at Motorola (United States) specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringMaterial ScienceComputer EngineeringMaterials EngineeringMechanical EngineeringMicrofabricationElectrical Insulation

Publications per year

2002–2004

6

Publications

6

Failure mechanism study of anisotropic conductive film (ACF) packages

L.L. Mercado, J. White, V. Sarihan et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 81 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Optimization of a SiGe:C HBT in a BiCMOS technology for low power wireless applications

J. John, F. Chai, David Morgan et al. · 2003 · 24 citations

Low-power Electronics, Bicmos Technology, Electrical Engineering +13

Encapsulated double-bump WL-CSP: design and reliability

Beth Keser, Betty Yeung, J. White et al. · 2002 · 22 citations

Engineering, Mechanical Engineering, Encapsulation Material +19

WL-CSP reliability with various solder alloys and die thicknesses

Beth Keser, Li Wetz, J. White · Microelectronics Reliability · 2003 · 18 citations

Materials Science, Reliability, Materials Engineering +8

Improvement in WL-CSP reliability by wafer thinning

Li Wetz, J. White, Beth Keser · 2004 · 14 citations

Engineering, Low Profile, Mechanical Engineering +16

1–5 of 6