L.L. Mercado - Concepedia

Author

L.L. Mercado

Motorola (United States)

Also Known As

L. Mercado, L.L. Mercado, Lawrence L. Mercado, Lei L. Mercado, Lei Mercado

Publications

811

Citations

H-Index

Concepts

All Affiliations

Motorola (United States)Intel (United States)Medtronic (United States)

About

L.L. Mercado is an author at Motorola (United States) specializing in engineering, electronic packaging, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	21	735
2	Electrical Engineering	13	16	599
3	Computer Engineering	4	4	93
4	Materials Engineering	4	4	267
5	Applied Physics	2	2	28

L.L. Mercado

Publications

745

Citations

H-Index

Page 1

	Year	Citations
Impact of flip-chip packaging on copper/low-k structures L.L. Mercado, Shun-Meen Kuo, Cindy Goldberg, IEEE Transactions on Advanced Packaging EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Electronic Packaging	2003	99
Analysis of flip-chip packaging challenges on copper/low-k interconnects L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo, IEEE Transactions on Device and Materials Reliability Materials EngineeringMaterials ScienceElectrical EngineeringFlip-chip Packaging ChallengesEngineering	2003	82
Failure mechanism study of anisotropic conductive film (ACF) packages L.L. Mercado, J. White, V. Sarihan, IEEE Transactions on Components and Packaging Technologies Materials EngineeringMaterials ScienceElectrical EngineeringFailure Mechanism StudyEngineering	2003	81
Microstructure and Mechanical Properties of Electroplated Cu Thin Films Alex A. Volinsky, Joseph B. Vella, Indira Adhihetty, MRS Proceedings Materials ScienceMaterials EngineeringElectromigration TechniqueEngineeringMechanical Properties	2000	55
Analysis of flip-chip packaging challenges on copper low-k interconnects L.L. Mercado, Cindy Goldberg, Shun-Meen Koo, Materials EngineeringSimulation MethodologyElectrical EngineeringFlip-chip Packaging ChallengesEngineering	2004	49
A mechanical approach to overcome RF MEMS switch stiction problem L.L. Mercado, Shun-Meen Koo, Tien‐Yu Tom Lee, Electrical EngineeringEngineeringMems SwitchesMicrofabricationRadio Frequency Micro-electromechanical Systems	2004	42
Evaluation of die edge cracking in flip-chip PBGA packages L.L. Mercado, V. Sarihan IEEE Transactions on Components and Packaging Technologies Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2003	37
Mechanics-Based Solutions to RF MEMS Switch Stiction Problem L.L. Mercado, S.-M. Kuo, T.-Y.T. Lee, IEEE Transactions on Components and Packaging Technologies EngineeringMems SwitchesMechanical EngineeringElectrostatic ForceMechatronic System	2004	36
Impact of solder pad size on solder joint reliability in flip chip PBGA packages L.L. Mercado, V. Sarihan, Yifan Guo, IEEE Transactions on Advanced Packaging ReliabilityPackage ReliabilityElectrical EngineeringReliability EngineeringEngineering	2000	35
A simulation method for predicting packaging mechanical reliability with low κ dielectrics L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo Interface DelaminationEngineeringLow κ DielectricsMechanical EngineeringPackaging Impact	2003	28

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