L.L. Mercado

Impact of flip-chip packaging on copper/low-k structures

L.L. Mercado, Shun-Meen Kuo, Cindy Goldberg et al. · IEEE Transactions on Advanced Packaging · 2003 · 99 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Analysis of flip-chip packaging challenges on copper/low-k interconnects

L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo et al. · IEEE Transactions on Device and Materials Reliability · 2003 · 82 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Failure mechanism study of anisotropic conductive film (ACF) packages

L.L. Mercado, J. White, V. Sarihan et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 81 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Alex A. Volinsky, Joseph B. Vella, Indira Adhihetty et al. · MRS Proceedings · 2000 · 55 citations

Materials Science, Materials Engineering, Electromigration Technique +4

Analysis of flip-chip packaging challenges on copper low-k interconnects

L.L. Mercado, Cindy Goldberg, Shun-Meen Koo et al. · 2004 · 49 citations

Materials Engineering, Simulation Methodology, Electrical Engineering +14