Shun-Meen Kuo - Concepedia

Author

Shun-Meen Kuo

Also Known As

Shun-Meen Kuo, Shunmeen Kuo

Publications

321

Citations

H-Index

Concepts

All Affiliations

Shun-Meen Kuo is an author at Motorola (United States) specializing in microelectronics, engineering, and electronic packaging.

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	270
2	Electrical Engineering	4	4	242
3	Applied Physics	1	1	17
4	Computer Engineering	1	1	44
5	Materials Engineering	1	1	82

Shun-Meen Kuo

Publications

270

Citations

H-Index

Page 1

	Year	Citations
Impact of flip-chip packaging on copper/low-k structures L.L. Mercado, Shun-Meen Kuo, Cindy Goldberg, IEEE Transactions on Advanced Packaging EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Electronic Packaging	2003	99
Analysis of flip-chip packaging challenges on copper/low-k interconnects L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo, IEEE Transactions on Device and Materials Reliability Materials EngineeringMaterials ScienceElectrical EngineeringFlip-chip Packaging ChallengesEngineering	2003	82
Compact Harmonic Filter Design and Fabrication Using IPD Technology Lianjun Liu, Shun-Meen Kuo, J. Abrokwah, IEEE Transactions on Components and Packaging Technologies Electrical EngineeringEngineeringIntegrated Passive DeviceHigh-frequency DeviceElectronic Engineering	2007	44
A simulation method for predicting packaging mechanical reliability with low κ dielectrics L.L. Mercado, Cindy Goldberg, Shun-Meen Kuo Interface DelaminationEngineeringLow κ DielectricsMechanical EngineeringPackaging Impact	2003	28
Thermal solutions for discrete and wafer-level rf mems switch packages L.L. Mercado, Tien‐Yu Tom Lee, Shun-Meen Kuo, IEEE Transactions on Advanced Packaging Mems DevicesEngineeringThermal SolutionsMicro-electromechanical SystemSemiconductor Device	2003	17

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