Tien‐Yu Tom Lee

An overview of experimental methodologies and their applications for die strength measurement

Betty Yeung, Tien‐Yu Tom Lee · IEEE Transactions on Components and Packaging Technologies · 2003 · 69 citations

Engineering, Measurement, Mechanical Engineering +21

Compact Thermal Resistor-Capacitor-Network Approach to Predicting Transient Junction Temperatures of a Power Amplifier Module

Youmin Yu, Tien‐Yu Tom Lee, Victor Adrian Chiriac · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 54 citations

Engineering, Energy Efficiency, Power Circuit +16

A mechanical approach to overcome RF MEMS switch stiction problem

L.L. Mercado, Shun-Meen Koo, Tien‐Yu Tom Lee et al. · 2004 · 42 citations

Electrical Engineering, Engineering, Mems Switches +13

Thermal limits of flip chip package-experimentally validated, CFD supported case studies

Tien‐Yu Tom Lee, M. Mahalingam · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 21 citations

Engineering, Energy Efficiency, Flip Chip Package +19

Thermal solutions for discrete and wafer-level rf mems switch packages

L.L. Mercado, Tien‐Yu Tom Lee, Shun-Meen Kuo et al. · IEEE Transactions on Advanced Packaging · 2003 · 17 citations

Mems Devices, Engineering, Thermal Solutions +19