Concepedia

Tien‐Yu Tom Lee

TT

8

Publications

243

Citations

8

H-Index

1996

Active since

Affiliations

Motorola (United States)(Current)

Tien‐Yu Tom Lee is an author at Motorola (United States) specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringHeat TransferThermal EngineeringThermodynamicsEnergy EfficiencyThermal ManagementComputer Engineering

Publications per year

1996–2012

8

Publications

8

An overview of experimental methodologies and their applications for die strength measurement

Betty Yeung, Tien‐Yu Tom Lee · IEEE Transactions on Components and Packaging Technologies · 2003 · 69 citations

Engineering, Measurement, Mechanical Engineering +21

Compact Thermal Resistor-Capacitor-Network Approach to Predicting Transient Junction Temperatures of a Power Amplifier Module

Youmin Yu, Tien‐Yu Tom Lee, Victor Adrian Chiriac · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 54 citations

Engineering, Energy Efficiency, Power Circuit +16

A mechanical approach to overcome RF MEMS switch stiction problem

L.L. Mercado, Shun-Meen Koo, Tien‐Yu Tom Lee et al. · 2004 · 42 citations

Electrical Engineering, Engineering, Mems Switches +13

Thermal limits of flip chip package-experimentally validated, CFD supported case studies

Tien‐Yu Tom Lee, M. Mahalingam · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 21 citations

Engineering, Energy Efficiency, Flip Chip Package +19

Thermal solutions for discrete and wafer-level rf mems switch packages

L.L. Mercado, Tien‐Yu Tom Lee, Shun-Meen Kuo et al. · IEEE Transactions on Advanced Packaging · 2003 · 17 citations

Mems Devices, Engineering, Thermal Solutions +19

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