Concepedia

Betty Yeung

BY

Statistics

Publications

9

Citations

346

H-Index

9

Active since

2000

Affiliations

Motorola (United States)(Current)

Betty Yeung is an author at Motorola (United States) specializing in materials engineering, materials science, and semiconductor reliability.

Publications per year

2000–2003

9

Publications

9

An overview of experimental methodologies and their applications for die strength measurement

Betty Yeung, Tien‐Yu Tom Lee · IEEE Transactions on Components and Packaging Technologies · 2003 · 70 citations

, , +17

Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Alex A. Volinsky, Joseph B. Vella, Indira Adhihetty et al. · MRS Proceedings · 2000 · 56 citations

, , +10

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · 2002 · 55 citations

, , +17

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

, , +17

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

Betty Yeung, Jin‐Wook Jang · Journal of Materials Science Letters · 2002 · 38 citations

, , +10

1–5 of 9