Concepedia

Betty Yeung

BY

Statistics

Publications

8

Citations

289

H-Index

8

Active since

2000

Affiliations

Motorola (United States)(Current)

Betty Yeung is an author at Motorola (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMicroelectronicsMicrostructureComputer Engineering3D PrintingFailure AnalysisMicrofabrication

Publications per year

2000–2003

8

Publications

8

An overview of experimental methodologies and their applications for die strength measurement

Betty Yeung, Tien‐Yu Tom Lee · IEEE Transactions on Components and Packaging Technologies · 2003 · 69 citations

Engineering, Measurement, Mechanical Engineering +21

Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Alex A. Volinsky, Joseph B. Vella, Indira Adhihetty et al. · MRS Proceedings · 2000 · 55 citations

Materials Science, Materials Engineering, Electromigration Technique +4

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

Engineering, Pb-free Solders, Mechanical Engineering +17

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

Betty Yeung, Jin‐Wook Jang · Journal of Materials Science Letters · 2002 · 38 citations

Assessment of backside processes through die strength evaluation

Betty Yeung, V. Hause, Tien-Yu Lee · IEEE Transactions on Advanced Packaging · 2000 · 34 citations

Engineering, Mechanical Engineering, Damage Mechanism +17

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