Concepedia

B. Hileman

BH

Statistics

Publications

1

Citations

14

H-Index

1

Active since

1996

Affiliations

Motorola (United States)(Current)

B. Hileman is an author at Motorola (United States) specializing in bonding, electrical engineering, and wafer bonding.

Publications per year

1996–1996

1

Publications

1

Application of a CFD tool in designing a fountain plating cell for uniform bump plating of semiconductor wafers

Tien‐Yu Tom Lee, William Lytle, B. Hileman · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 14 citations

, , +14

1–1 of 1