IEEE Transactions on Components Hybrids and Manufacturing Technology

S-parameter-based IC interconnect transmission line characterization

W.R. Eisenstadt, Y. Eo · 1992 · 627 citations

Engineering, Electrical Engineering, Circuit Theory +16

Constitutive relations for tin-based solder joints

Robert Darveaux, K. Banerji · 1992 · 469 citations

Natural Sciences, Materials Engineering, Materials Science +17

Heat sink optimization with application to microchannels

Roy W. Knight, D. J. Hall, J. S. Goodling et al. · 1992 · 411 citations

Natural Sciences, Mechanical Engineering, Physics +17

Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

W. Engelmaier · 1983 · 362 citations

Engineering, Materials Engineering, Materials Science +17

Fatigue of 60/40 Solder

H. D. Solomon · 1986 · 300 citations

Natural Sciences, Materials Engineering, Materials Science +17