Concepedia

W. Engelmaier

WE

Statistics

Publications

12

Citations

856

H-Index

12

Active since

1978

Affiliations

AT&T (United States)(Current)

Nokia (United States)

W. Engelmaier is an author at AT&T (United States) specializing in engineering, device reliability, and materials engineering.

Publications per year

1978–2002

12

Publications

12

Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

W. Engelmaier · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 362 citations

Engineering, Materials Engineering, Materials Science +17

Functional Cycles and Surface Mounting Attachment Reliability

W. Engelmaier · Circuit World · 1985 · 104 citations

Engineering, Materials Science, Semiconductor Devices +12

Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards

W. Engelmaier, A.I. Attarwala · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 101 citations

Engineering, Materials Engineering, Materials Science +14

Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction

W. Engelmaier · Soldering and Surface Mount Technology · 1989 · 60 citations

Engineering, Materials Engineering, Condition Assessment +16

Generic reliability figures of merit design tools for surface mount solder attachments

W. Engelmaier · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 54 citations

Engineering, Materials Engineering, Materials Science +17

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