Lakshmi N. Ramanathan

Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing

Jin‐Wook Jang, Lakshmi N. Ramanathan, Jong‐Kai Lin et al. · Journal of Applied Physics · 2004 · 62 citations

Materials Science, Materials Engineering, Engineering +14

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Lakshmi N. Ramanathan, Jihun Jang, J. K. Lin et al. · Journal of Electronic Materials · 2005 · 38 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung‐Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu et al. · Journal of Materials Science Materials in Electronics · 2006 · 38 citations

Materials Science, Electrical Engineering, Electromigration Technique +12

Emerging reliability challenges in electronic packaging

D. R. Frear, Lakshmi N. Ramanathan, Jin‐Wook Jang et al. · 2008 · 25 citations

Advanced Packaging, Reliability, Electrical Engineering +15

Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages

Seung‐Hyun Chae, Xuefeng Zhang, Huang-Lin Chao et al. · 2006 · 20 citations

Engineering, Plastic Flip-chip Packages, Advanced Packaging (Semiconductors) +17