Seung‐Hyun Chae

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Journal of Applied Physics · 2006 · 121 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Yiwei Wang, Kuan Lu, Vikas Gupta et al. · Journal of materials research/Pratt's guide to venture capital sources · 2012 · 57 citations

Materials Science, Materials Engineering, Electrical Engineering +6

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung‐Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu et al. · Journal of Materials Science Materials in Electronics · 2006 · 38 citations

Materials Science, Electrical Engineering, Electromigration Technique +12

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution

Seung‐Hyun Chae, Jie-Hua Zhao, Darvin Edwards et al. · IEEE Transactions on Device and Materials Reliability · 2009 · 33 citations

Engineering, Dicing Technique, Mechanical Engineering +16

Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

Yiwei Wang, Seung‐Hyun Chae, Rajiv Dunne et al. · 2012 · 30 citations

Engineering, Imc Formation, Interconnect (Integrated Circuits) +19