Concepedia

Seung‐Hyun Chae

SC

Statistics

Publications

13

Citations

712

H-Index

12

Active since

2006

Affiliations

The University of Texas at Austin(Current)

Texas Instruments (United States)

Seung‐Hyun Chae is an author at The University of Texas at Austin specializing in materials engineering, materials science, and electronic materials.

Publications per year

2006–2013

13

Publications

13

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Acta Materialia · 2007 · 209 citations

, , +16

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Journal of Applied Physics · 2006 · 121 citations

, , +17

Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Seung‐Hyun Chae, Jie-Hua Zhao, Darvin Edwards et al. · Journal of Electronic Materials · 2010 · 73 citations

, , +14

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Brook Chao, Xuefeng Zhang, Seung‐Hyun Chae et al. · Microelectronics Reliability · 2009 · 73 citations

, , +11

Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Yiwei Wang, Kuan Lu, Vikas Gupta et al. · Journal of materials research/Pratt's guide to venture capital sources · 2012 · 57 citations

, , +12

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