Publication | Closed Access
Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
57
Citations
12
References
2012
Year
Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringSn Grain StructureElectronic PackagingSn–ag Solder JointsMicrostructure
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