Concepedia

Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Yiwei Wang, Kuan Lu, Vikas Gupta, Leon Stiborek, Dwayne R. Shirley, Seung‐Hyun Chae, Jay Im, Paul S. Ho

Journal of materials research/Pratt's guide to venture capital sources · 2012 · 57 citations · 12 references

DOI

Concepts

References

12

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

, , +6

Lead (Pb)-free solders for electronic packaging

Sung K. Kang, Amit Sarkhel · Journal of Electronic Materials · 1994 · 333 citations

, , +8

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 260 citations

, , +17

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Minhua Lu, Da‐Yuan Shih, Paul Lauro et al. · Applied Physics Letters · 2008 · 246 citations

, , +16

Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin

D. C. Yeh, H. B. Huntington · Physical Review Letters · 1984 · 188 citations

, , +14