Concepedia

Jay Im

JI

Statistics

Publications

45

Citations

2.4K

H-Index

26

Active since

2006

Affiliations

The University of Texas at Austin(Current)

Xilinx (United States)

Xilinx (Ireland)

Texas Instruments (United States)

Jay Im is an author at The University of Texas at Austin specializing in engineering, electrical engineering, and materials science.

Publications per year

2006–2023

45

Publications

45

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Acta Materialia · 2007 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Kuan Lu, Xuefeng Zhang, Suk-Kyu Ryu et al. · 2009 · 208 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 56-Gb/s PAM4 Wireline Transceiver Using a 32-Way Time-Interleaved SAR ADC in 16-nm FinFET

Yohan Frans, Jaewook Shin, Lei Zhou et al. · IEEE Journal of Solid-State Circuits · 2017 · 162 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal stress induced delamination of through silicon vias in 3-D interconnects

Kuan Lu, Suk-Kyu Ryu, Qiu Zhao et al. · 2010 · 125 citations

Engineering, Materials Engineering, Materials Science +17

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Journal of Applied Physics · 2006 · 121 citations

Natural Sciences, Materials Engineering, Materials Science +17

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