Publication | Closed Access

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringPb-free SoldersApplied PhysicsCu–sn Intermetallic CompoundsElectronic PackagingMicroelectronicsElectromigration ParametersInterconnect (Integrated Circuits)