Suk-Kyu Ryu

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-Kyu Ryu, Kuan-Hsun Lu, Xuefeng Zhang et al. · IEEE Transactions on Device and Materials Reliability · 2010 · 257 citations

Engineering, Electrical Engineering, Materials Science +17

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Kuan Lu, Xuefeng Zhang, Suk-Kyu Ryu et al. · 2009 · 208 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal stress induced delamination of through silicon vias in 3-D interconnects

Kuan Lu, Suk-Kyu Ryu, Qiu Zhao et al. · 2010 · 125 citations

Engineering, Materials Engineering, Materials Science +17

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-Kyu Ryu, Kuan-Hsun Lu, Tengfei Jiang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 119 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-Kyu Ryu, Tengfei Jiang, Kuan Lu et al. · Applied Physics Letters · 2012 · 115 citations

Engineering, Materials Engineering, Materials Science +17