Kuan-Hsun Lu

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-Kyu Ryu, Kuan-Hsun Lu, Xuefeng Zhang et al. · IEEE Transactions on Device and Materials Reliability · 2010 · 253 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Journal of Applied Physics · 2006 · 121 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-Kyu Ryu, Kuan-Hsun Lu, Tengfei Jiang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 118 citations

Engineering, Carrier Mobility, Silicon On Insulator +17

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung‐Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu et al. · Journal of Materials Science Materials in Electronics · 2006 · 38 citations

Materials Science, Electrical Engineering, Electromigration Technique +12

Thermomechanical reliability of through-silicon vias in 3D interconnects

Kuan-Hsun Lu, Suk-Kyu Ryu, Jay Im et al. · 2011 · 29 citations

Materials Engineering, 3D Ic Architecture, Electrical Engineering +15