Concepedia

Darvin Edwards

DE

Statistics

Publications

20

Citations

1.2K

H-Index

17

Active since

1981

Affiliations

Texas Instruments (United States)(Current)

The University of Texas at Austin

National Cheng Kung University

Lamar University

Darvin Edwards is an author at Texas Instruments (United States) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMicroelectronicsElectrical EngineeringSolid MechanicsMechanics Of MaterialsMicrostructureHeat Transfer

Publications per year

1981–2012

20

Publications

20

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations

Engineering, Mechanical Engineering, Kirkendall Void Formation +16

Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

Dhruv Bhate, Dennis Chan, Ganesh Subbarayan et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 103 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds

Mark D. Placette, Xuejun Fan, Jie-Hua Zhao et al. · Microelectronics Reliability · 2012 · 82 citations

Materials Science, Mold Control, Chemical Engineering +7

Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Seung-Hyun Chae, Jie-Hua Zhao, Darvin Edwards et al. · Journal of Electronic Materials · 2010 · 72 citations

Materials Science, Rheological Constitutive Equation, Rheological Measurement +12

Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests

Jie-Hua Zhao, John Tellkamp, Vijay Gupta et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 62 citations

Engineering, Mechanical Engineering, Silicon On Insulator +19

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