Tz-Cheng Chiu

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Publications

Citations

1.4K

H-Index

Active since

1999

Affiliations

National Cheng Kung University(Current)

Texas Instruments (United States)

Advanced Semiconductor Engineering (Taiwan)

Lehigh University

Industrial Technology Research Institute

Tz-Cheng Chiu is an author at National Cheng Kung University specializing in materials science, materials engineering, and mechanical behavior of materials.

ORCID

Publications per year

1999–2021

Publications

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 437 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations

Engineering, Materials Engineering, Materials Science +17

Stress-induced voiding under vias connected to wide Cu metal leads

E.T. Ogawa, J. W. McPherson, J. Rosal et al. · 2003 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +15

ONE-DIMENSIONAL WAVE PROPAGATION IN A FUNCTIONALLY GRADED ELASTIC MEDIUM

Tz-Cheng Chiu, F. Erdoğan · Journal of Sound and Vibration · 1999 · 113 citations

Engineering, Mechanical Engineering, Acoustics +9

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Tz-Cheng Chiu, En-Yu Yeh · Microelectronics Reliability · 2017 · 66 citations

Engineering, Manufacturing Engineering, Materials Science +16

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