Concepedia

Tz-Cheng Chiu

TC

Statistics

Publications

21

Citations

1.3K

H-Index

14

Active since

1999

Affiliations

National Cheng Kung University(Current)

Texas Instruments (United States)

Advanced Semiconductor Engineering (Taiwan)

Lehigh University

Industrial Technology Research Institute

Tz-Cheng Chiu is an author at National Cheng Kung University specializing in engineering, mechanical engineering, and materials science.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceSolid MechanicsElectronic PackagingMechanics Of MaterialsMechanicsApplied PhysicsMicroelectronicsElectrical Engineering

Publications per year

1999–2021

21

Publications

21

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations

Engineering, Mechanical Engineering, Kirkendall Void Formation +16

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 247 citations

Materials Science, Electrical Engineering, Reliability Engineering +15

Stress-induced voiding under vias connected to wide Cu metal leads

E.T. Ogawa, J. W. McPherson, J. Rosal et al. · 2003 · 149 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

ONE-DIMENSIONAL WAVE PROPAGATION IN A FUNCTIONALLY GRADED ELASTIC MEDIUM

Tz-Cheng Chiu, F. Erdoğan · Journal of Sound and Vibration · 1999 · 112 citations

Stress Wave, Nonlinear Elasticity, Engineering +6

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Tz-Cheng Chiu, En-Yu Yeh · Microelectronics Reliability · 2017 · 63 citations

Advanced Packaging, Chip-scale Package, Engineering +10

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